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Reuters · Summer Zhen ·

Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September

China's top memory chipmaker, CXMT (688825.SS), will supply its latest LPDDR6 DRAM chips for Xiaomi's upcoming flagship folding phone, the companies said on Saturday.

In this story CXMT LPDDR6 Xiaomi Xiaomi 18 Fold Xring O3
Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September

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Reuters — Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September ↗

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Related stories

Reuters: Chinese DRAM chipmaker CXMT says its new fifth-gen technology platform enters mass production and unveils two 24Gb LPDDR5X phone memory products built on it
Bloomberg: Xiaomi launches the Xring O3, a 3nm SoC for its mobile devices, as the company seeks to reduce reliance on longtime suppliers Qualcomm and MediaTek
South China Morning Post: Xiaomi unveils the Xring O100, a 6nm AI accelerator to boost its MiMo models when paired with its O3 mobile chip, and the 3nm Xring D100 for autonomous driving
Bloomberg: CXMT says it plans to launch a 4F² design DRAM chip for data center servers before the end of 2026, achieving a breakthrough that rivals have pursued for years
The Information: CXMT has begun producing HBM3E memory chips in small quantities and plans to expand production in 2027, a major advance for China's chip industry

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