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Reuters · Summer Zhen ·

Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September

China's top memory chipmaker, CXMT (688825.SS), will supply its latest LPDDR6 DRAM chips for Xiaomi's upcoming flagship folding phone, the companies said on Saturday.

In this story CXMT LPDDR6 Xiaomi Xiaomi 18 Fold Xring O3
Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September

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Reuters — Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September ↗

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Related stories

Bloomberg: Xiaomi launches the Xring O3, a 3nm SoC for its mobile devices, as the company seeks to reduce reliance on longtime suppliers Qualcomm and MediaTek
South China Morning Post: Xiaomi unveils the Xring O100, a 6nm AI accelerator to boost its MiMo models when paired with its O3 mobile chip, and the 3nm Xring D100 for autonomous driving
The Information: CXMT has begun producing HBM3E memory chips in small quantities and plans to expand production in 2027, a major advance for China's chip industry
9to5Mac: Apple announces a "Surprise and shine" event on September 9 at 10am PT at Apple Park, where its first foldable iPhone, iPhone 18 Pro, and more are expected
Bloomberg: Xiaomi reports Q2 revenue down 6.1% YoY to ~$16.2B and net income down 21% to ~$1.4B, above est., amid a persistent memory shortage and weaker smartphone demand

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