TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun
Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.
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TSMC Breaks Ground on Arizona Chip Packaging Plant
TSMC has started building an advanced chip packaging facility in Arizona, targeting a 2029 opening.
TSMC isn't done expanding in Arizona. The Taiwanese chipmaking giant has begun construction on an advanced chip packaging plant in the state, with plans to have it operational by 2029.
The news comes from TSMC Senior Vice President Kevin Zhang, who confirmed both the timeline and the construction kickoff. Chip packaging is a critical step in semiconductor manufacturing — it's the process that turns raw silicon dies into functional, deployable chips.
This facility adds another layer to TSMC's growing American footprint. The company already has fab projects underway in Arizona, but a dedicated packaging plant signals a push toward a more complete domestic supply chain. Until now, most advanced packaging work has stayed in Taiwan.
The 2029 target gives TSMC roughly three years to get the plant up and running. For an industry obsessed with reducing reliance on overseas manufacturing, this is a meaningful step forward.