Search Agents MCP CLI

Categories

AIStartupsVentureRobotics

Article Tags

CryptoSpaceEVsBiotechCloud ComputingHardwarePrivacySocial MediaTransportationFundraisingCommerceGovernmentMediaSemiconductorsWearablesDronesQuantum ComputingSaaSDevToolsDataAppsSecurityGadgetsFintechOpen Source

Story Topics

AIOpenAIAnthropicGoogleAppleNvidiaCryptoCybersecurityVenture CapitalRobotics
Entities
Swipe Feed Bookmarks Archive Leaderboard Stats RSS Sitemap
Contact Terms Privacy
Reuters ·

Microsoft says Maia 300 racks will hold 96 chips and use ~167 kW of power and plans to roll out "multi-gigawatt deployments" of the chip starting next year

Microsoft (MSFT.O) announced the next generation of its custom AI chip on Monday and said it plans to deploy potentially …

Microsoft
In this story Maia 300 Microsoft
Microsoft says Maia 300 racks will hold 96 chips and use ~167 kW of power and plans to roll out "multi-gigawatt deployments" of the chip starting next year

Lead Source

Reuters — Microsoft says Maia 300 racks will hold 96 chips and use ~167 kW of power and plans to roll out "multi-gigawatt deployments" of the chip starting next year ↗

How this story grew

Coverage · 0 Discussion · 0
Oct 12Oct 14

Coverage

The Verge: Microsoft unveils its third-gen in-house AI chip, the Maia 300, built on TSMC's N2P process node and aimed at serving as its “primary AI inference system”

More

Microsoft: Microsoft
DatacenterDynamics: DatacenterDynamics
Forkast: Forkast
Cloud Computing News: Cloud Computing News
The Information: The Information
Bloomberg: Bloomberg
GeekWire: GeekWire
CNBC: CNBC
Windows Report: Windows Report
Moor Insights & Strategy: Moor Insights & Strategy
Deirdre Bosa on YouTube: Deirdre Bosa on YouTube

Discussion

@fry69.dev @tomwarren.co.uk
@brendanburkex @satyanadella @microsoft @dps @dnystedt @dee_bosa @viticci @kimmonismus @dee_bosa @azure @mustafasuleyman @oguzerkan @elonmusk @patricktoulme @chamath @dee_bosa @tomwarren @edzitron @benbajarin @dee_bosa @patrickmoorhead @thoefler @austinsemis @cryptopunk7213 @edludlow @ziv_ravid @omercheema @cgtwts @hesamation @aaronpholmes @theprimeagen @choblin29 @jpinsights @dee_bosa @aschilling

Related stories

Bloomberg: Microsoft plans to expand its data center capacity from 12GW today to 38GW+ by 2032, with about a third of the 38GW centered on AI-specific chips
Reuters: Cerebras unveils CS-4, a server rack powered by three WSE-3 Turbo chips and built around its new Nexus architecture, with first shipments starting in Q3 2026
Bloomberg: DeepSeek plans to use 160K+ of Huawei's Ascend 950DT chips at an Inner Mongolia data center, which would create one of the largest Huawei chip clusters
Bloomberg: Meta says it plans to deploy MTIA 450, its third-generation custom AI chip, in data centers in H1 2027, followed by a broad rollout of MTIA 500 by end of 2027
The Register: Intel says Xeon 7, aimed at HPC and debuting in 2027, will support up to 256 cores and 22 chiplets, with 16 built on its bleeding-edge 18A-P process

Discuss with AI

ChatGPT ↗ Claude ↗
← Back to TechSnif