Reuters · Wen-Yee Lee ·

MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boosted AI performance, as it competes with Qualcomm

Taiwan's MediaTek (2454.TW) unveiled on Tuesday a new smartphone chip made using TSMC's (2330.TW) most advanced manufacturing technology …

AI Semiconductors

In this story Dimensity 9600M Dimensity 9600 Pro MediaTek Qualcomm TSMC

MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boosted AI performance, as it competes with Qualcomm

Lead Source

Reuters — MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boosted AI performance, as it competes with Qualcomm ↗

How this story grew

Coverage · 0 Discussion · 0

Sep 15Sep 16

More

MediaTek: MediaTek

9to5Google: 9to5Google

Wccftech: Wccftech

HotHardware: HotHardware

Engadget: Engadget

PCMag: PCMag

Taipei Times: Taipei Times

SammyGuru: SammyGuru

Android Police: Android Police

XimiTime: XimiTime

Phandroid: Phandroid

SamMobile: SamMobile

Neowin: Neowin

Nikkei Asia: Nikkei Asia

CNET: CNET

The Verge: The Verge

Seoul Economic Daily: Seoul Economic Daily

Unite.AI: Unite.AI

Nokiamob: Nokiamob

Related stories

Bloomberg: Xiaomi launches the Xring O3, a 3nm SoC for its mobile devices, as the company seeks to reduce reliance on longtime suppliers Qualcomm and MediaTek

South China Morning Post: Xiaomi unveils the Xring O100, a 6nm AI accelerator to boost its MiMo models when paired with its O3 mobile chip, and the 3nm Xring D100 for autonomous driving

Bloomberg: Samsung unveils the Galaxy S26 FE, offering an Exynos, not Qualcomm, chipset, 12GB of RAM, a dialed-back camera system from the S26, for $700+, a $50 price jump

Reuters: Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September

Bloomberg: Meta says it plans to deploy MTIA 450, its third-generation custom AI chip, in data centers in H1 2027, followed by a broad rollout of MTIA 500 by end of 2027

Discuss with AI

ChatGPT ↗ Claude ↗

← Back to TechSnif