Bloomberg · Sangmi Cha ·

Chinese chip foundry CanSemi, focused on automotive, industrial, and IoT chips, files for an IPO on Shenzhen stock exchange's ChiNext, seeking to raise ~$919M

Chinese chip foundry CanSemi Technology Inc. is seeking to raise about 6.16 billion yuan ($919 million) in an initial public offering …

Semiconductors Venture Capital

In this story CanSemi ChiNext

Chinese chip foundry CanSemi, focused on automotive, industrial, and IoT chips, files for an IPO on Shenzhen stock exchange's ChiNext, seeking to raise ~$919M

Lead Source

Bloomberg — Chinese chip foundry CanSemi, focused on automotive, industrial, and IoT chips, files for an IPO on Shenzhen stock exchange's ChiNext, seeking to raise ~$919M ↗

How this story grew

Coverage · 0 Discussion · 0

Sep 23Sep 24

More

Reuters: Reuters

Related stories

Reuters: Filings: The Shanghai Stock Exchange accepted China-based chipmaker YMTC's application to list its shares on the STAR Market; YMTC seeks to raise ~$4.9B

Bloomberg: Filing: Tencent-backed AI chipmaker Enflame prices its Shanghai IPO at ~$21 per share, aiming to sell 43M shares and raise ~$911M

Bloomberg: Filing: San Jose-based Chinese optical module maker Ligent seeks ~$727M in a Hong Kong IPO, after its rival Zhongji Innolight's $6.8B Hong Kong debut in July

Financial Times: YMTC, which seeks to raise $5B in an IPO, told investors in IPO prep meetings that it aims to become the largest NAND flash supplier by the end of 2027

Bloomberg: Singapore-based data center operator DayOne confidentially files for a US IPO, aims to list as soon as next quarter, and is considering raising ~$5B

Discuss with AI

ChatGPT ↗ Claude ↗

← Back to TechSnif