Huawei says it aims to make 1.4nm chips by 2031 using its "LogicFolding" tech, which is based on its new Tau Scaling Law intended to bypass Moore's Law limits

Huawei just dropped a bold semiconductor play. At an IEEE conference, the Chinese tech giant proposed a new chip scaling law — essentially a fresh blueprint for cramming more transistors onto silicon.

The goal: design chips with transistor density equivalent to 1.4nm process technology by 2031. That's an ambitious target for a company operating under heavy U.S. export restrictions that have cut it off from leading-edge foundries.

The announcement signals Huawei's intent to close the gap with global chipmaking leaders through novel design approaches rather than relying solely on access to the most advanced manufacturing nodes.

Details on the specific methodology remain sparse, but the core claim is clear — Huawei believes it has found a new pathway to push its semiconductor capabilities forward despite the constraints it faces. Whether the physics and engineering cooperate remains to be seen.