TSMC Shelves ASML's Priciest Chip Machines Until After 2029
TSMC won't deploy ASML's cutting-edge high-NA EUV lithography gear in production until at least 2030, citing cost concerns.
TSMC is pumping the brakes on the semiconductor industry's shiniest new toy. The world's largest contract chipmaker says it won't use ASML's most advanced high-NA EUV lithography machines in production through 2029.
The reason? Pure economics. Each of these next-gen machines costs upwards of €350 million — a staggering price tag even for a company printing money like TSMC.
High-NA EUV represents the bleeding edge of chip manufacturing technology, promising finer patterning and more advanced nodes. But TSMC apparently thinks it can keep pushing boundaries with existing tools for now.
The decision is a notable signal for ASML, which has been banking on high-NA adoption to drive its next growth phase. TSMC's wait-and-see approach suggests the cost-to-benefit math simply doesn't add up yet for high-volume production.