Samsung Signs Preliminary HBM4 Deal With AMD
Samsung will supply next-gen HBM4 memory and DDR5 for AMD's upcoming data center accelerators and processors.
Samsung Electronics and AMD have inked a preliminary agreement covering next-generation memory and computing tech. The deal positions Samsung as a supplier of its HBM4 memory for AMD's MI455X accelerators — chips built for data center AI workloads.
The arrangement also covers DDR5 memory for AMD's Helios platform. Beyond pure supply, the two companies agreed to collaborate on advancing AI memory and computing technologies together.
For Samsung, this is a significant win in the high-bandwidth memory race, where competition with SK Hynix and Micron remains fierce. For AMD, securing a next-gen memory partner strengthens its hand against Nvidia in the AI accelerator market.
Worth noting: this is a preliminary deal, not a finalized contract. The specifics of volume, pricing, and timelines remain to be locked down.